Inclusion of Integration Layer
Problem Certain designs require built in features such as heating elements in order to achieve the desired functionality. As of now, an integration layer which would allow the inclusion of such parts does not exist in 3Duf. For this reason, certain designs, namely some continuous flow PCR chips, cannot be designed or rendered in 3Duf.
Solution The inclusion of an integration layer would allow users to implement more complicated designs involving more varied parts and part-to-part interactions. The ability to apply heat or electrical current or specify regions manufactured out of a different material or to serve as air buffers would greatly increase the versatility and applicability of 3Duf.
Alternatives An alternative would be to include parts such as heating elements in the existing control or flow layer and rely on multiple levels for proper positioning. This alternative would likely serve to only complicate the existing layers and require the development of many new, highly-specified parts in order to fit the format of these layers.
Additional context
Example of integration of a heating element and air insulation in a PCR circuit. Heaters are necessary for controlling the temperature of the fluid as it passes through the circuit, allowing the polymerase reaction to occur. Image retrieved from article referenced below.
https://pubs.rsc.org/en/content/articlelanding/2004/LC/b406860b#!divAbstract